VANSTREELS, Kris

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VANSTREELS, Kris
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kris.vanstreels@uhasselt.be
 
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Publications

Results 1-13 of 13 (Search time: 0.0 seconds).

Issue DateTitleContributor(s)TypeCat.
12008Increasing the mean grain size in copper films and featuresVANSTREELS, Kris; Brongersma, S.H.; Tokei, Zs.; Carbonell, L; DE CEUNINCK, Ward; D'HAEN, Jan; D'OLIESLAEGER, MarcJournal ContributionA1
22007Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfillLeaming-Sphabmixay, K.; VAN OLMEN, Jan; Moon, K. J.; VANSTREELS, Kris; D'HAEN, Jan; Tokei, Z.; List, S.; Beyer, G.Journal ContributionA1
32007High sputter bias super secondary grain growth initiation (In structures)VANSTREELS, Kris; BRONGERSMA, Sywert; D'HAEN, Jan; DEMUYNCK, Steven; DE CEUNINCK, Ward; CALUWAERTS, Rudi; D'OLIESLAEGER, MarcProceedings PaperC1
42007Increasing the mean grain size in copper films and featuresVANSTREELS, KrisTheses and DissertationsT1
52007Microstructural evolution of cu interconnect under AC, pulsed DC and DC current stressBIESEMANS, Leen; VANSTREELS, Kris; BRONGERSMA, Sywert; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, MarcProceedings PaperC1
62006Influence of grain orientation on the microstructural characterization in cu during (self)-anneal using a surface acoustic wave techniqueSekiguchi, K.; VANSTREELS, Kris; Demuynck, S.; D'HAEN, Jan; Brongersma, S.Proceedings PaperC1
72006Stress in Next Generation InterconnectsBrongersma, S.H.; Iacopi, F.; VANSTREELS, Kris; Tökei, Z.; Bruynseraede, C.; Demuynck, S.; D'HAEN, JanProceedings PaperC1
82006Super secondary grain growth initiation in electroplated copperVANSTREELS, Kris; Brongersma, SH; Demuynck, S; Carbonell, L; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; Maex, KProceedings PaperC1
92005A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structureVANSTREELS, Kris; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; D'HAEN, Jan; Maex, KarenJournal ContributionA1
102004A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structureVANSTREELS, Kris; D'OLIESLAEGER, Marc; DE CEUNINCK, Ward; D'HAEN, Jan; Maex, KarenProceedings PaperC1
112004Super secondary grain growth in the barrier/seedlayer systemVANSTREELS, Kris; Brongersma, S.H.; Demuynck, S.; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, Marc; Maex, KarenProceedings PaperC1
122004MTF test system with AC based dynamic joule correction for electromigration tests on interconnectsBIESEMANS, Leen; Schepers, K; VANSTREELS, Kris; D'HAEN, Jan; DE CEUNINCK, Ward; D'OLIESLAEGER, MarcJournal ContributionA1
132003Copper deposition and subsequent grain structure evolution in narrow linesBrongersma, SH; D'HAEN, Jan; VANSTREELS, Kris; DE CEUNINCK, Ward; Vervoort, I; Maex, KProceedings PaperC1